diff options
| author | Leonard Kugis <leonard@kug.is> | 2021-01-20 14:45:41 +0000 |
|---|---|---|
| committer | Leonard Kugis <leonard@kug.is> | 2021-01-20 14:45:41 +0000 |
| commit | 34f5c2e29ff3af662a83f793bb5cc37624668a1c (patch) | |
| tree | db9842f30c9bd849407d27b8606d28cb8a869f3c /lib/footprints/BGA30N40P6X5_253X211X60N.kicad_mod | |
| parent | 0a0295e999e22d94b71552e68bb141865972df38 (diff) | |
| download | turboswap-34f5c2e29ff3af662a83f793bb5cc37624668a1c.tar.gz | |
Add component libraries (symbols and footprints)
Diffstat (limited to 'lib/footprints/BGA30N40P6X5_253X211X60N.kicad_mod')
| -rw-r--r-- | lib/footprints/BGA30N40P6X5_253X211X60N.kicad_mod | 59 |
1 files changed, 59 insertions, 0 deletions
diff --git a/lib/footprints/BGA30N40P6X5_253X211X60N.kicad_mod b/lib/footprints/BGA30N40P6X5_253X211X60N.kicad_mod new file mode 100644 index 0000000..56e5433 --- /dev/null +++ b/lib/footprints/BGA30N40P6X5_253X211X60N.kicad_mod @@ -0,0 +1,59 @@ + +(footprint BGA30N40P6X5_253X211X60N (layer F.Cu) (tedit 698B277F) + (descr "") + (attr smd) + (fp_text reference REF** (at 0.54 -3.008 0) (layer F.SilkS) + (effects (font (size 0.8 0.8) (thickness 0.15))) + ) + (fp_text value BGA30N40P6X5_253X211X60N (at 10.192 3.008 0) (layer F.Fab) + (effects (font (size 0.8 0.8) (thickness 0.15))) + ) + (pad A1 smd circle (at -0.8 -1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad A2 smd circle (at -0.4 -1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad A3 smd circle (at 0.0 -1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad A4 smd circle (at 0.4 -1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad A5 smd circle (at 0.8 -1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad B1 smd circle (at -0.8 -0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad B2 smd circle (at -0.4 -0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad B3 smd circle (at 0.0 -0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad B4 smd circle (at 0.4 -0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad B5 smd circle (at 0.8 -0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad C1 smd circle (at -0.8 -0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad C2 smd circle (at -0.4 -0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad C3 smd circle (at 0.0 -0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad C4 smd circle (at 0.4 -0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad C5 smd circle (at 0.8 -0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad D1 smd circle (at -0.8 0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad D2 smd circle (at -0.4 0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad D3 smd circle (at 0.0 0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad D4 smd circle (at 0.4 0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad D5 smd circle (at 0.8 0.2) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad E1 smd circle (at -0.8 0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad E2 smd circle (at -0.4 0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad E3 smd circle (at 0.0 0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad E4 smd circle (at 0.4 0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad E5 smd circle (at 0.8 0.6) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad F1 smd circle (at -0.8 1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad F2 smd circle (at -0.4 1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad F3 smd circle (at 0.0 1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad F4 smd circle (at 0.4 1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (pad F5 smd circle (at 0.8 1.0) (size 0.25 0.25) (layers F.Cu F.Mask F.Paste) (solder_mask_margin 0.102)) + (fp_circle (center -1.557 -1.0) (end -1.457 -1.0) (layer F.SilkS) (width 0.2)) + (fp_circle (center -1.557 -1.0) (end -1.457 -1.0) (layer F.Fab) (width 0.2)) + (fp_line (start 1.057 1.2685) (end -1.057 1.2685) (layer F.Fab) (width 0.127)) + (fp_line (start 1.057 -1.2685) (end -1.057 -1.2685) (layer F.Fab) (width 0.127)) + (fp_line (start 1.057 1.2685) (end 1.057 -1.2685) (layer F.Fab) (width 0.127)) + (fp_line (start -1.057 1.2685) (end -1.057 -1.2685) (layer F.Fab) (width 0.127)) + (fp_line (start 1.245 1.445) (end 0.6225 1.445) (layer F.SilkS) (width 0.127)) + (fp_line (start 1.245 1.445) (end 1.245 0.7225) (layer F.SilkS) (width 0.127)) + (fp_line (start -1.245 1.445) (end -0.6225 1.445) (layer F.SilkS) (width 0.127)) + (fp_line (start -1.245 1.445) (end -1.245 0.7225) (layer F.SilkS) (width 0.127)) + (fp_line (start -1.245 -1.445) (end -0.6225 -1.445) (layer F.SilkS) (width 0.127)) + (fp_line (start -1.245 -1.445) (end -1.245 -0.7225) (layer F.SilkS) (width 0.127)) + (fp_line (start 1.245 -1.445) (end 0.6225 -1.445) (layer F.SilkS) (width 0.127)) + (fp_line (start 1.245 -1.445) (end 1.245 -0.7225) (layer F.SilkS) (width 0.127)) + (fp_line (start -2.057 2.2685) (end 2.057 2.2685) (layer F.CrtYd) (width 0.05)) + (fp_line (start -2.057 -2.2685) (end 2.057 -2.2685) (layer F.CrtYd) (width 0.05)) + (fp_line (start -2.057 2.2685) (end -2.057 -2.2685) (layer F.CrtYd) (width 0.05)) + (fp_line (start 2.057 2.2685) (end 2.057 -2.2685) (layer F.CrtYd) (width 0.05)) +)
\ No newline at end of file |
